毕业于北京理工大学材料科学与工程专业，主要从事功能复合材料方面的研究工作。在钴及钴基复合材料的制备及电磁波吸收性能的研究方面取得突出成绩，已在该领域以第一作者发表SCI论文7篇。参与了多个项目研究工作，包括国家自然基金，北京市自然基金，总装备部十二五国防预研项目。

 

个人信息：

杨珮珮博士/讲师

宁夏大学光伏材料重点实验室

中国，宁夏，银川市  750021

电话：+86-18195215631

电子邮箱：pearl_yang@nxu.edu.cn

教育背景：

材料成型及控制工程，工学学士，合肥工业大学，2007.09~2011.07

材料科学与工程，工学博士，北京理工大学（硕博连读），2011.07~2017.09

 

研究工作经历：

宁夏大学宁夏光伏材料重点实验室讲师    2017.09~今

 

研究方向：

功能复合材料的设计、制备及其电磁波吸收性能的研究

主要学术成果：

[1]    Peipei Yang, Xiuchen Zhao, Ying Liu,Yue Gu. Facile, large-scale and expeditious synthesisof hollow Co and Co@Fe nanostructures: Application for electromagnetic waveabsorption [J]. Journal of Physical Chemistry C, 2017, 121(15), 8557-8568.

[2]    Peipei Yang, Ying Liu, Xiuchen Zhao,Jingwei Cheng, Hong Li. Electromagnetic wave absorption properties ofmechanically alloyed FeCoNiCrAlhigh entropy alloy powders [J]. Advanced Powder Technology, 2016, 27(4):1128-1133.

[3]    Peipei Yang, Ying Liu, Xiuchen Zhao,Cong Zhang. Electromagnetic wave absorption properties for FeCoNiCr alloypowders with magnetic field heat treatment [J]. Journal of materials science:Materials in electronics, 2017, 28(13): 9867-9875.

[4]    Peipei Yang, Ying Liu, Xiuchen Zhao,Jingwei Cheng, Hong Li. Electromagnetic wave absorption properties ofFeCoNiCrAl_0.8 high entropy alloy powders and its amorphous structureprepared by high-energy ball milling [J]. Journal of Materials Research, 2016,31(16): 2398-2406.

[5]    Peipei Yang, Xiuchen Zhao, Ying Liu,Xianhua Lai. Preparation and tribological properties of dual-coated CuOnanoparticles as water based lubricant additives [J]. Journal of Nanoscienceand Nanotechnology, 2016, 16(9): 9683-9689.

[6]    Peipei Yang, Xiuchen Zhao, Ying Liu,Xianhua Lai. Preparation and electromagnetic wave absorption properties of hollowCo, Fe@air@Co and Fe@Co nanoparticles [J].  Advanced Powder Technology, 2016,27(4): 1128-1133.

[7]    Peipei Yang, Ying Liu, Xiuchen Zhao,Cong Zhang. The thickness of Fe shell on the electromagnetic wave absorptionproperties of hollow Fe-Co double shell particles [J]. Journal of materialsscience: Materials in electronics, 2016, 31(16): 2398-2406.